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WMFG

 

 

 

Excellence in Engineering & Production

Zytek's strength lies in its combination of capabilities... engineering expertise when you need it... prototype or volume production using the latest equipment at all times... with fulfillment and support to help you get your products to market.

Our expertise

·        advanced wireless & optical assembly;

·        defense and aerospace business activities;

·        medical & life sciences;

·        embedded computing;

·        test & measurement;

·        Higher Level Assembly (HLA) / integration; and

·        box build.

At Zytek we believe that the customer is integral and partner to ALL our activities.

 

Whether you need all aspects of EMS or just a piece of the circle, we will build your focus team towards you specific needs and grow with you as partners.

 

Customer Circle
 

Manufacturing Services

RF & Optical Module Assembly and test

Systems Assembly and test

Flex Circuit Assembly and test

Precision Electromechanical Assembly and test

BGA & uBGA Repair, X-Ray and rework

4 Complete SMT Lines

 

 

Fulfillment Services

Product Distribution

Warranty and Repair Services

 

 

Testing

Design for test

In circuit  test

Boundary, Test Jet & Polarity 
Functional test

High speed RF Function Screening

Analog& High Speed Digital

Functional test development

 

Assembly Capabilities

·        Printed Circuit Board Assembly (PCBA)

o   Through Hole

o   Surface Mount (SMT)

o   Flip Chip

o   BGA

o   Chip Scale Package (CSP)

·        HLA/Box Build/System

o   Configure-to-Order (CTO)

o   Build-to-Order (BTO)

o   Direct Order Fulfillment (DOF)

·        Optics

o   Component Integration

o   Fiber Management

·        RoHS Compliance

·        Laminates - Rigid, PCMCIA Rigid Flex, Flex, >.250" Thickness, Low Dk


Component Technology

·         0.4mm Pitch QFP

·         Flip Chip - Up to 18mm x 35mm x 0.1 mm die

·         BGA - > 1500 I/O

·         CBGA - > 800 I/O

·         CCGA - > 1500 I/O

·         PGA - > 591 I/O

·         Chip Scale Package (CSP), to 0.4mm Pitch

·         Optical Actives and Passives

 

©2011 Zytek Electronics Manufacturing Services. All Rights Reserved.